PACE's ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success! Designed for today's PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs.